Old Web
English
Sign In
Acemap
>
authorDetail
>
Su-Jeong Jeon
Su-Jeong Jeon
Electronics and Telecommunications Research Institute
Soldering
Interposer
Flip chip
Bumping
Electronic engineering
3
Papers
2
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Carrier Diffusion Effect in Gain Chip and 60 mW Tunable External Cavity Laser with Diffusion-Limited Gain Chip and Polymer-Based Waveguide Grating
2019
OFC | Optical Fiber Communication Conference
Dong-Churl Kim
Young-Tak Han
Dong Hoon Lee
Seok-Tae Kim
Su-Jeong Jeon
Sang-Ho Park
Jang-Uk Shin
Yong-Hwan Kwon
Jong Hoi Kim
Yongsoon Baek
Ho-Sung Cho
Show All
Source
Cite
Save
Citations (0)
3D SiP module using TSV and novel low-volume solder-on-pad(SoP) process
2012
Electronics System-integration Technology Conference
Hyun-Cheol Bae
Ho-Eun Bae
Su-Jeong Jeon
Kwang-Hoon Jung
Yong-Sung Eom
Kwang-Seong Choi
Show All
Source
Cite
Save
Citations (1)
Novel low-volume solder-on-pad (SoP) material and process for flip chip bonding using Au stud bumps
2012
ECTC | Electronic Components and Technology Conference
Kwang-Seong Choi
Ho-Eun Bae
Su-Jeong Jeon
Hyun-Cheol Bae
Yong-Sung Eom
Show All
Source
Cite
Save
Citations (1)
1