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Seth Kruger
Seth Kruger
SEMATECH
Materials science
Electronic engineering
Composite material
Wafer
Dielectric
4
Papers
9
Citations
0
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TSV and Cu-Cu direct bond wafer and package-level reliability
2013
ECTC | Electronic Components and Technology Conference
Klaus Hummler
Brian Sapp
J. R. Lloyd
Seth Kruger
Stephen Olson
Seungbae Park
Bruce T. Murray
Dae Young Jung
Stephen R. Cain
Ah-Young Park
D. Ferrone
Iqbal Ali
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Methodology to evaluate pre-applied underfill materials with concurrent flux capability for ultra-fine pitch solder-based interconnects
2013
ECTC | Electronic Components and Technology Conference
Sunoo Kim
Seth Kruger
Brian Sapp
Ho Hyung Lee
Seungbae Park
Sitaram Arkalgud
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Effect of slurry on Vapor Deposition Polymerization (VDP)Chemical Mechanical Planarization (CMP) in Through-Silicon Via (TSV) Applications
2012
Iqbal Ali
Brian Sapp
Roger A. Quon
Seth Kruger
Kaoru Maekawa
Kippei Sugita
Hiroyuki Hashimoto
Matthias Stender
Jeff Dysard
Sitaram Arkalgud
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Understanding and Controlling Cu Protrusions in 3D TSV Processing
2012
Seth Kruger
Klaus Hummler
Robert E. Geer
Kathleen Dunn
Colin McDonough
Aaron Cordes
Jack Enloe
Brian Sapp
Iqbal Ali
Stefan Pieper
Sitaram Arkalgud
Thomas Murray
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