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T. Dai
T. Dai
Xiamen University
Scanning electron microscope
Chemistry
Metallurgy
Thin film
Sputter deposition
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Thermal Stability of Copper-Aluminum Alloy Thin Films for Barrierless Copper Metallization on Silicon Substrate
2017
Journal of Electronic Materials
Cheng Wang
T. Dai
Yinghua Lu
Zhiguo Shi
J. J. Ruan
Y. H. Guo
X.J. Liu
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