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H. C. Fu
H. C. Fu
Industrial Technology Research Institute
Materials science
Electronic engineering
Wafer backgrinding
Die preparation
Wafer
5
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14
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TSV-less BSI-CIS wafer-level package and stacked CIS module
2013
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Zhi-Cheng Hsiao
Cheng-Ta Ko
H. H. Chang
H. C. Fu
C. W. Chiang
W. L. Tsai
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Citations (4)
Thin wafer handling process evaluation for 3DIC integration
2012
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
H. H. Chang
W. L. Tsai
Chun-Hsien Chien
H. C. Fu
C. W. Chiang
Yun-Tien Chen
Wei-Chung Lo
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Low temperature process evaluation for 3DIC integrated thin wafer handling
2012
Yun-Tien Chen
W. L. Tsai
H. H. Chang
Chun-Hsien Chien
H. C. Fu
C. W. Chiang
Wei-Chung Lo
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Citations (6)
A low cost rigid-flex opto-electrical link for mobile devices
2010
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Sheng-Ho Huang
Chun-Hsing Lee
Hung-Lien Hu
Mu-Tao Chu
Jen-Hao Yeh
Yuan-Chin Chen
Yu-Ming Huang
Chao-Kai Hsu
H. H. Chang
H. C. Fu
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Citations (3)
Recent Trend of Optical Circuit Board in Taiwan
2007
PAMP | International Conference on Polymers and Adhesives in Microelectronics and Photonics
Shin-Ge Lee
Chun-Hsing Lee
Chien-Chun Lu
Fu-Yi Cheng
Kun-Yi Shen
Sheng-Ho Huang
Li Cheng-shen
Shu-Ming Chang
H. H. Chang
H. C. Fu
Pei Tien
Mu-Tao Chu
Yi-Jen Chan
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