Old Web
English
Sign In
Acemap
>
authorDetail
>
E. Bantog
E. Bantog
Packaging engineering
Chip-scale package
Electronic engineering
Materials science
Application-specific integrated circuit
1
Papers
4
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Wire bond, flip-chip, and chip-scale-package solution to high silicon integration
2006
ECTC | Electronic Components and Technology Conference
E. Bantog
S. Chiu
C. T. Chen
H. P. Pu
C.S. Hsiao
Show All
Source
Cite
Save
Citations (4)
1