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Keenan Bosworth
Keenan Bosworth
Composite material
Materials science
Electronic engineering
Extrusion
Atomic layer deposition
1
Papers
7
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Application of a Metallic Cap Layer to Control Cu TSV Extrusion
2017
ECTC | Electronic Components and Technology Conference
Golareh Jalilvand
Omar Ahmed
Keenan Bosworth
Cullen Fitzgerald
Zhenlin Pei
Tengfei Jaing
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Citations (7)
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