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Charles Alix Manier
Charles Alix Manier
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Materials science
Electronic engineering
Electrical engineering
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5
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40
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Investigation and Modelling of Etching Through Silicon Carbide Vias (TSiCV) for SiC Interposer and Deep SiC Etching for Harsh Environment MEMS by DoE
2021
IEEE Transactions on Components, Packaging and Manufacturing Technology
Piotr Maćkowiak
Kolja Erbacher
Michael Schiffer
Charles Alix Manier
Michael Tvpper
Ha-Duong Ngo
Martin Schneider-Ramelow
Klaus-Dieter Lang
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3D integration of standard integrated circuits
2013
DIC | IEEE International D Systems Integration Conference
Rene Puschmann
Mathias Bottcher
Irene Bartusseck
Frank Windrich
Conny Fiedler
Peggy John
Charles Alix Manier
Kai Zoschke
Jurgen Grafe
Hermann Oppermann
Jürgen Wolf
K. Dieter Lang
Michael Ziesmann
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A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub- $\mu$ W RTC Mode and Programmable HF Clocks
2013
ISSCC | International Solid-State Circuits Conference
David Ruffieux
Nicola Scolari
Frédéric Giroud
Thanh Le
Silvio Dalla Piazza
Felix Staub
Kai Zoschke
Charles Alix Manier
Hermann Oppermann
James Dekker
T. Suni
Giorgio Allegato
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Citations (16)
Via last technology for direct stacking of processor and flash
2012
ECTC | Electronic Components and Technology Conference
Rene Puschmann
Mathias Bottcher
Michael Ziesmann
Irene Bartusseck
Frank Windrich
Conny Fiedler
Peggy John
Charles Alix Manier
Kai Zoschke
Jurgen Grafe
Hermann Oppermann
M. Jürgen Wolf
K. Dieter Lang
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Slip-rolling resistance of novel Zr(C,N) thin film coatings under high Hertzian contact pressures
2010
Charles Alix Manier
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Citations (5)
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