Old Web
English
Sign In
Acemap
>
authorDetail
>
Y. Hallez
Y. Hallez
STMicroelectronics
Silicon
Thermal resistance
Thermal
Temperature measurement
Composite material
2
Papers
3
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (2)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Carbon-based patterned heat spreaders for thermal mitigation of wire bonded packages
2017
THERMINIC | International Workshop on Thermal Investigations of ICs and Systems
Jean-Philippe Colonna
R. Prieto
Perceval Coudrain
Y. Hallez
D. Campos
O. Le-Briz
R. Franiatte
C. Brunet Manquat
Christian Chancel
V. Rat
Show All
Source
Cite
Save
Citations (2)
Heat spreading packaging solutions for hybrid bonded 3D-ICs
2016
DIC | IEEE International D Systems Integration Conference
R. Prieto
Perceval Coudrain
Jean-Philippe Colonna
Y. Hallez
Christian Chancel
V. Rat
Sylvain Dumas
G. Romano
R. Franiatte
C. Brunet-Manquiat
Severine Cheramy
A. Farcy
Show All
Source
Cite
Save
Citations (1)
1