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Ric van Doremalen
Ric van Doremalen
Philips
Wireless
Electronic engineering
Engineering
Signal processing
Electrical engineering
5
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17
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Miniature wireless activity monitor using 3D system integration
2009
Ric van Doremalen
Piet van Engen
Wouter Jochems
Shi Cheng
Thomas Fritzsch
Walter De Raedt
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Citations (3)
3D Si-level integration in wireless sensor node
2009
Piet van Engen
Ric van Doremalen
Wouter Jochems
Ad Rommers
Shi Cheng
Anders Rydberg
Thomas Fritzsch
J. Wolf
W. De Raedt
Philippe Muller
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Citations (6)
Wireless activity monitor using 3D itegration
2009
DTIP | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Ric van Doremalen
Piet van Engen
Wouter Jochems
Ad Rommers
Geert Maas
Shi Cheng
Anders Rydberg
Thomas Fritzsch
Walter De Raedt
Roelof Jansen
Philippe Muller
Eduardo Alarcon
Mihai A. T. Sanduleanu
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Citations (3)
Body surface backed flexible antennas and 3D Si-level integrated wireless sensor nodes for 17 GHz wireless body area networks
2009
Piet van Engen
Shi Cheng
Ric van Doremalen
Mihai A. T. Sanduleanu
Anders Rydberg
Klas Hjort
Paul Hallbjörner
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Citations (5)
Wireless activity monitor using 3D integration
2009
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Ric van Doremalen
Piet van Engen
Wouter Jochems
Ad Rommers
Geert Maas
Shi Cheng
Anders Rydberg
Thomas Fritzsch
Jürgen Wolf
W. De Raedt
Roelof Jansen
Philippe Muller
Eduardo Alarcon
Mihai A. T. Sanduleanu
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