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Jichoel Bea
Jichoel Bea
Tohoku University
Materials science
Electrical resistance and conductance
Interposer
Integrated circuit packaging
Composite material
2
Papers
7
Citations
0
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2024
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Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application
2020
ASMC | Advanced Semiconductor Manufacturing Conference
M. Murugesan
K. Mori
Toshiya Kojima
Hiroyuki Hashimoto
Jichoel Bea
T. Fukushima
M. Koyanagi
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Fully-Filled, Highly-Reliable Fine-Pitch Interposers with TSV Aspect Ratio >10 for Future 3D-LSI/IC Packaging
2019
ECTC | Electronic Components and Technology Conference
Murugesan Murugesan
Takafumi Fukushima
Kiyoharu Mori
Ai Nakamura
Yisang Lee
Makoto Motoyoshi
Jichoel Bea
Shigeru Watariguchi
Mitsumasa Koyanagi
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Citations (6)
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