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M. Saiful Islam
M. Saiful Islam
Auburn University
Flip chip
Composite material
Piezoresistive effect
Electronic engineering
Materials science
3
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3
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Material Characterization and Die Stress Measurement of Low Expansion PCB for Extreme Environments
2005
AeroConf | IEEE Aerospace Conference
D. Scott Copeland
M. Kaysar Rahim
M. Saiful Islam
Jeffrey C. Suhling
Richard C. Jaeger
Pradeep Lall
G. Tianb
K. Vasoya
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Measurement of Electronic Packaging Material Behavior and Flip Chip Die Stresses at Extreme Low Temperatures
2005
M. Kaysar Rahim
Jeffrey C. Suhling
Richard C. Jaeger
M. Saiful Islam
Hongtao Ma
Chang Lin
Pradeep Lall
Roy W. Knight
Mark Strickland
Jim Blanche
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Measurement of the Constitutive Behavior of Underfill Encapsulants
2003
M. Saiful Islam
Jeffrey C. Suhling
Pradeep Lall
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