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Tim M. Philip
Tim M. Philip
IBM
Reflection (mathematics)
Grain boundary
Materials science
Copper
Phase (matter)
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Grain boundary scattering in Ru and Cu interconnects
2020
IITC | International Interconnect Technology Conference
Troels Markussen
Shela Aboud
Anders Blom
Nicholas A. Lanzillo
Tue Gunst
Jonathan Cobb
Tim M. Philip
Robert R. Robison
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