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Tsuen-Sung Chen
Tsuen-Sung Chen
Industrial Technology Research Institute
Electronic engineering
Wafer
Materials science
Control theory
Logic gate
3
Papers
4
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0
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Implementation of memory stacking on logic controller by using 3DIC 300mm backside TSV process integration
2016
VLSIT | Symposium on VLSI Technology
Shang-Chun Chen
Pei-Jer Tzeng
Yu-Chen Hsm
Chung-Chih Wang
Po-Chih Chang
Jui-Chm Chen
Yiu-Hsiang Chang
Tsuen-Sung Chen
Tzu-Chien Hsu
Hsiang-Hung Chang
Chau-Jie Zhan
Chia-Hsin Lee
Yung-Fa Chou
Ding-Ming Kwai
Tzu-Kun Ku
Pei-Hua Wang
Wei-Chung Lo
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Backside-TSV process development and integration for 2∼3um small size TSV
2016
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Tzu-Chien Hsu
Po-Chih Chang
Chung-Chih Wang
Yiu-Hsiang Chang
Tsuen-Sung Chen
Yu-Chen Hsin
Jui-Chin Chen
Yuan-Chang Lee
Shang-Chun Chen
Jen-Chun Wang
Chao-Kai Hsu
Su-Hsin Lin
Chiung Yu Lo
Hsiang-Hung Chang
Chih-Lin Wang
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High thermal dissipation of light emitting diodes by integrating thin film process and packaging technology
2011
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Yi Shou Tsai
Chung-Yen Hsu
K. F. Lin
Yiu-Hsiang Chang
Hung-Lien Hu
Tsuen-Sung Chen
C. W. Chu
Mu-Tao Chu
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