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Nicolas Bresson
Nicolas Bresson
European Automobile Manufacturers Association
Materials science
Visual inspection
Metrology
Electronic engineering
Process control
5
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11
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0
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Die-to-Wafer 3D Interconnections Operating at Sub-Kelvin Temperatures for Quantum Computation
2020
ESTC | Electronics System-integration Technology Conference
Candice Thomas
Jean Charbonnier
A. Garnier
Nicolas Bresson
Frank Fournel
Sébastien Renet
Remi Franiatte
Nadine David
Vivien Thiney
Matias Urdampilleta
Tristan Meunier
Maud Vinet
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New Flip-Chip Bonder Dedicated To Direct Bonding For Production Environment
2018
Electronics System-integration Technology Conference
Pascal Metzger
Nicolas Raynaud
A. Jouve
Nicolas Bresson
L. Sanchez
Frank Fournel
Severine Cheramy
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Smart in-line defectivity/metrology process control solution for advanced 3D integration
2016
Amina Sidhoum
Nicolas Devanciard
Franck Bana
Arnaud Garnier
Nicolas Bresson
Sandra Bos
Stephane Rey
Carlos Beitia
Dario Alliata
Darcy Hart
John Thornell
Justin Miller
Gilles Vera
Scott Balak
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Citations (3)
Invited) Ultra Fine Pitch 3D Interconnects
2016
S. Cheramy
Franck Bana
Nicolas Bresson
Arnaud Garnier
Lucile Arnaud
A. Jouve
Didier Lattard
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Improving mean time to develop micro-bump/pillar fabrication process for vertical interconnections by combined defectivity and metrology approach
2015
Nicolas Devanciard
Franck Bana
Nicolas Bresson
Stephane Rey
Carlos Beitia
Dario Alliata
Darcy Hart
John Thornell
Justin Miller
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Citations (2)
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