Old Web
English
Sign In
Acemap
>
authorDetail
>
Ken Cheung
Ken Cheung
ASM International
Wafer-level packaging
Compression molding
Epoxy
Molding (process)
Composite material
3
Papers
29
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Characterizations of Fan-out Wafer-Level Packaging
2017
Ming Li
Qingqian Li
John H. Lau
Nelson Fan
Eric Kuah
Wu Kai
Ken Cheung
Zhang Li
Kim Hwee Tan
Iris Xu
Dong Chen
Rozalia Beica
Cheng-Ta Ko
Henry Yang
Sze Pei Lim
Jiang Ran
Cao Xi
Show All
Source
Cite
Save
Citations (7)
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
2017
ECTC | Electronic Components and Technology Conference
John H. Lau
Ming Li
Dewen Tian
Nelson Fan
Eric Kuah
Wu Kai
Margie Li
Ji Hao
Ken Cheung
Zhang Li
Kim Hwee Tan
Rozalia Beica
Cheng-Ta Ko
Yu-Hua Chen
Sze Pei Lim
Ning Cheng Lee
Koh Sau Wee
Jiang Ran
Cao Xi
Show All
Source
Cite
Save
Citations (10)
Development of chip-first and die-up fan-out wafer level packaging
2017
EPTC | Electronics Packaging Technology Conference
Xuan Hua
Hong Xu
Li Zhang
Dong Chen
Kim Hwee Tan
Chiming Lai
John H. Lau
Ming Li
Margie Li
Eric Kuah
Nelson Fan
Wu Kai
Ken Cheung
Show All
Source
Cite
Save
Citations (12)
1