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Chun-Yen Ting
Chun-Yen Ting
Electronic engineering
Flip chip
Antenna array
Materials science
Ball grid array
5
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11
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A Low-Cost Antenna-in-Package Solution for 77GHz Automotive Radar Applications
2019
ICEP | International Conference on Electronics Packaging
Cheng-Yu Ho
Sheng-Chi Hsieh
Ming-Fong Jhong
Hung-Chun Kuo
Chun-Yen Ting
Chen-Chao Wang
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Citations (1)
Low interconnection loss and low-cost approach for Antenna in Package of 77GHz Automotive Radar applications
2018
ICEPT | International Conference on Electronic Packaging Technology
Cheng-Yu Ho
Chen-Chao Wang
Sheng-Chi Hsieh
Chun-Yen Ting
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Antenna-on-package on low-cost organic substrate for 60 GHz wireless communication applications
2017
ICEPT | International Conference on Electronic Packaging Technology
Cheng-Yu Ho
Ming-Fong Jhong
Po-Chih Pan
Chun-Yen Ting
Chen-Chao Wang
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Millimeter-wave antenna in package on low-cost organic substrate for flip chip chip scale (FCCSP) package
2017
ICSJ | CPMT Symposium Japan
Cheng-Yu Ho
Sheng-Chi Hsieh
Ming-Fong Jhong
Po-Chih Pan
Chen-Chao Wang
Chun-Yen Ting
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Antenna array integrated on multilayer organic package for millimeter-wave applications
2016
EPTC | Electronics Packaging Technology Conference
Cheng-Yu Ho
Ming-Fong Jhong
Po-Chih Pan
Chen-Chao Wang
Chun-Yen Ting
Ken-Huang
Lin En-Yi Hsueh
Shang-Hao Liu
Hung-Chia Chang
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Citations (5)
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