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Sangwo Park
Sangwo Park
Hanyang University
Adsorption
Analytical chemistry
Through-silicon via
Materials science
Direct current
1
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13
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Through-silicon-via (TSV) filling by electrodeposition with pulse-reverse current
2016
Microelectronic Engineering
Sanghyun Jin
Sungho Seo
Sangwo Park
Bongyoung Yoo
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Citations (13)
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