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VClizy Villacoublay
VClizy Villacoublay
Electronic engineering
Packaging engineering
Soldering
Ball grid array
Flip chip
1
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6
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Microprocessor packaging strategy: Reliability of various Flip Chip BGA packages on different Printed Circuit Boards
2004
A. Guilhaume-Chaillot
C. Munier
M. Michaud
Eads Ccr
VClizy Villacoublay
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Citations (6)
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