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Shinichi Harada
Shinichi Harada
IBM
Materials science
Electronic engineering
Wire bonding
Finite element method
Composite material
2
Papers
3
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0
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Evaluation of back end of line structures underneath wirebond pads in ultra low-k device
2012
ECTC | Electronic Components and Technology Conference
Toyohiro Aoki
Takashi Hisada
Keishi Okamoto
J. Malinowski
Keith F. Beckham
YongSeok Yang
JoonSu Kim
Shinichi Harada
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Citations (2)
Fine Pitch Wirebonds on Ultra Low-k Device
2011
Transactions of The Japan Institute of Electronics Packaging
Takashi Hisada
Toyohiro Aoki
Keishi Okamoto
Shinichi Harada
J. Malinowski
Keith F. Beckham
Thomas M. Shaw
Xiao H. Liu
Brian Wayne Herbst
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Citations (1)
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