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Niteesh Marathe
Niteesh Marathe
University of California, Los Angeles
Surface roughness
Composite material
Materials science
Engineering drawing
Thermocompression bonding
3
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50
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Heterogeneous Integration at Fine Pitch (≤ 10 µm) Using Thermal Compression Bonding
2017
ECTC | Electronic Components and Technology Conference
Adeel Bajwa
SivaChandra Jangam
Saptadeep Pal
Niteesh Marathe
Tingyu Bai
Takafumi Fukushima
Mark S. Goorsky
Subramanian S. Iyer
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Citations (46)
Low temperature metal-metal bonding for heterogeneous integration and performance scaling
2017
Mark S. Goorsky
Kari Schjølberg-Henriksen
Brett Beekley
Niteesh Marathe
Karthick Mani
Adeel Bajwa
Subramanian S. Iyer
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Citations (1)
Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects.
2016
Adeel Bajwa
Niteesh Marathe
SivaChandra Jangam
Saptadeep Pal
Ping-Yu Liu
Mark S. Goorsky
Subramanian S. Iyer
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Citations (3)
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