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Vincent Delaye

Council for the Curriculum, Examinations & Assessment

6

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14

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Investigation of the Low Temperature / High Temperature Approach to Produce Si0.5Ge0.5 and Pure Ge Strain Relaxed Buffers

2016
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Mechanical understanding of 100 mm InP and GaAs direct bonded heterostructure

2015 Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems
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Direct bonding of titanium layers on silicon

2013 Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems
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Wafer Level 3D Stacking Using Smart Cut and Metal-Metal Direct Bonding Technology

2013
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Demonstration of Single Crystal GaAs Layers on CTE-Matched Substrates by the Smart Cut Technology

2012
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Thin film quartz layer reported on silicon

2011 EFTF | European Frequency and Time Forum
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