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Chandrasekhar Mandalapu
Chandrasekhar Mandalapu
Composite material
Materials science
Interconnection
Wafer dicing
Daisy chain
2
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2
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Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications
2018
ECTC | Electronic Components and Technology Conference
B. Lee
Rajesh Katkar
Guilian Gao
Gill Fountain
Sangil Lee
Liang Wang
Chandrasekhar Mandalapu
Cyprian Emeka Uzoh
Laura Mirkarimi
Bob Sykes
Max Litjens
Yuling Niu
Shuai Shao
Jing Wang
Seungbae Park
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Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding
2018
ECTC | Electronic Components and Technology Conference
Guilian Gao
Laura Mirkarimi
Gill Fountain
Liang Wang
Cyprian Emeka Uzoh
Thomas Workman
Gabe Guevara
Chandrasekhar Mandalapu
B. Lee
Rajesh Katkar
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