Old Web
English
Sign In
Acemap
>
authorDetail
>
Hung Yi Huang
Hung Yi Huang
TSMC
Electroplating
Metallurgy
Annealing (metallurgy)
Copper
Materials science
1
Papers
10
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A new enhancement layer to improve copper interconnect performance
2010
IITC | International Interconnect Technology Conference
Hung Yi Huang
C. H. Hsieh
S.M. Jeng
Hun-Jan Tao
Min Cao
Y. J. Mii
Show All
Source
Cite
Save
Citations (10)
1