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T. Motobe
T. Motobe
Wafer-level packaging
Dielectric
Fan-out
Optoelectronics
Materials science
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3
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Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan-Out Wafer-Level Packaging (FO-WLP)
2019
T Enomoto
J. I. Matthews
T. Motobe
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Citations (3)
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