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Vijay Kulkarni
Vijay Kulkarni
Intel
Ball grid array
Soldering
Materials science
Cyclic stress
Finite element method
3
Papers
52
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Board level solder joint assembly and reliability for ultra thin BGA packages
2012
ECTC | Electronic Components and Technology Conference
Mohammad M. Hossain
Srinivasa R. Aravamudhan
Marilyn Nowakowski
Xiaoqing Ma
Satyajit Walwadkar
Vijay Kulkarni
Sriram Muthukumar
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Citations (1)
Vibration Testing and Analysis of Ball Grid Array Package Solder Joints
2007
ECTC | Electronic Components and Technology Conference
Shaw Fong Wong
Pramod Malatkar
Canham Rick
Vijay Kulkarni
Ian Chin
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Citations (51)
Vibration Testing andAnalysis ofBallGridArrayPackage Solder Joints
2007
Electronic Components and Technology Conference
Pramod Malatkar
Vijay Kulkarni
Jalan Hi-Tech
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