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David D. Hillman
David D. Hillman
Rockwell Collins
Soldering
Chemistry
Materials science
Metallurgy
Temperature cycling
4
Papers
22
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Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys
2019
Journal of Electronic Materials
André M. Delhaise
Polina Snugovsky
Jeffrey Kennedy
David D. Hillman
Ivan Matijevic
Stephan J. Meschter
David P. Adams
Milea Kammer
Marianne Romansky
Joseph M. Juarez
Ivan Straznicky
L. Snugovsky
Ross K. Wilcoxon
Doug D. Perovic
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Citations (4)
Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
2018
Maxim Serebreni
Patrick McCluskey
David D. Hillman
Nathan Blattau
Craig Hillman
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Citations (4)
Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints
2012
Journal of Electronic Materials
Iver E. Anderson
Adam J. Boesenberg
Joel Harringa
David Riegner
Andrew Steinmetz
David D. Hillman
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Citations (14)
Applications et procédés pour un verre de silicate alcalin
2009
Nathan P. Lower
Alan P. Boone
Ross K. Wilcoxon
Guy N. Smith
Nathaniel P. Wyckoff
Brandon C. Hamilton
David D. Hillman
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