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Masaaki Harazono
Masaaki Harazono
Kyocera
Electronic engineering
Materials science
Chip-scale package
Chip
Metallurgy
5
Papers
15
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0
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Organic Chip Carrier for Next Generation
2015
Journal of The Surface Finishing Society of Japan
Masaaki Harazono
Kenji Terada
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Thermal and Reliability Demonstration of a Large Die on a Low CTE Chip Scale Package
2014
Tomoyuki Yamada
Masahiro Fukui
Kenji Terada
Masaaki Harazono
Teruya Fujisaki
Sushumna Iruvanti
Charles Carey
Yi Pan
Charlie Reynolds
Kamal K. Sikka
Brian R. Sundlof
Hilton T. Toy
Rebecca N. Wagner
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Organic Chip Scale Package (CSP) Development for Flip Chip Applications
2013
Tomoyuki Yamada
Masahiro Fukui
Kenji Terada
Masaaki Harazono
Teruya Fujisaki
Charles L. Reynolds
Jean Audet
Yi Pan
Scott Preston Moore
Sushumna Iruvanti
Hsichang Liu
Hongqing Zhang
Brian R. Sundlof
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Development of a Low CTE chip scale package
2013
ECTC | Electronic Components and Technology Conference
Tomoyuki Yamada
Masahiro Fukui
Kenji Terada
Masaaki Harazono
Charles L. Reynolds
Jean Audet
Sushumna Iruvanti
Hsichang Liu
Scott Preston Moore
Yi Pan
Hongqing Zhang
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Citations (11)
Interface Formation Between Metal and Polyimide in High Wiring Density Build-up Substrate
2011
IEEE Transactions on Components, Packaging and Manufacturing Technology
Kimihiro Yamanaka
Hidetoshi Yugawa
Masaaki Harazono
Yoshihiro Hosoi
Masahiro Fukui
Norihiro Inagaki
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Citations (2)
1