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Brian Lai
Brian Lai
Thermo Fisher Scientific
Materials science
Electronic engineering
Thermography
Phase (waves)
Lock (computer science)
4
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4
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0
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Addressing Failures in Advanced Packaging Through a Correlative Workflow
2020
Neel Leslie
Brian Lai
Heebeom Lee
Mingi Lee
Christopher H. Kang
Zuzana Patakova
Frantisek Zelenka
Trond Varslot
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Improved Phase Data Acquisition for Thermal Emissions Analysis
2018
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Wen Oiu
Bernice Zee
Brian Lai
Jim Vickers
David Tien
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Study of Phase Shift of Lock-In Thermography and Its Application in 2.5D IC Package
2018
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Yu Ting Lin
Brian Lai
Chun-Cheng Tsao
Yi-Sheng Lin
Yu-Hsiang Hsiao
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Defect Z-depth Determination in Flip-chip using lock-in thermography
2017
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Wen Qiu
Bemice Zee
Herve Deslandes
Brian Lai
David Tien
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