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Chinami Marushima
Chinami Marushima
IBM
Soldering
Materials science
Bumping
Composite material
Metallurgy
4
Papers
1
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0
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CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
2021
ECTC | Electronic Components and Technology Conference
Risa Miyazawa
Chinami Marushima
Toyohiro Aoki
Akihiro Horibe
Takashi Hisada
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Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
2021
ICEP | International Conference on Electronics Packaging
Chinami Marushima
Toyohiro Aoki
Sayuri Kohara
Ryota Yamaguchi
Nobuhiro Sekine
Kenichi Yatsugi
Kuniaki Sueoka
Takashi Hisada
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Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
2020
Eiji Nakamura
Toyohiro Aoki
Ryota Yamaguchi
Nobuhiro Sekine
Kuniaki Sueoka
Chinami Marushima
Kenichi Yatsugi
Makoto Yada
Takashi Hisada
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Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
2020
Risa Miyazawa
Eiji Nakamura
Chinami Marushima
Toyohiro Aoki
Takashi Hisada
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