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Xiaomin Duan
Xiaomin Duan
IBM
CMOS
Silicon on insulator
Electronic engineering
Equivalent circuit
Engineering
4
Papers
29
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Characterization of TSV-Induced Loss and Substrate Noise Coupling in Advanced Three-Dimensional CMOS SOI Technology
2013
IEEE Transactions on Components, Packaging and Manufacturing Technology
Xiaoxiong Gu
Joel Abraham Silberman
Albert M. Young
Keith A. Jenkins
Bing Dang
Yong Liu
Xiaomin Duan
Rachel Gordin
Shlomo Shlafman
David Goren
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Citations (12)
Mitigating TSV-induced substrate noise coupling in 3-D IC using buried interface contacts
2012
EPEP | Electrical Performance of Electronic Packaging
Xiaoxiong Gu
Joel Abraham Silberman
Yong Liu
Xiaomin Duan
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A through-silicon-via to active device noise coupling study for CMOS SOI technology
2011
ECTC | Electronic Components and Technology Conference
Xiaomin Duan
Xiaoxiong Gu
Jonghyun Cho
Joungho Kim
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Citations (5)
A through-silicon-via to active device noise coupling study for CMOS SOI technology
2011
Electronic Components and Technology Conference
Xiaomin Duan
Xiaoxiong Gu
Jonghyun Cho
Joungho Kim
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Citations (3)
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