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T.L. Tai
T.L. Tai
IBM
Dielectric
Analytical chemistry
Ashing
Ion
Chemistry
3
Papers
31
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Effect of radical species density and ion bombardment during ashing of extreme ultralow-κ interlevel dielectric materials
2007
Journal of Applied Physics
Marcus A. Worsley
Stacey F. Bent
Nicholas C. M. Fuller
T.L. Tai
James P. Doyle
M. Rothwell
Timothy J. Dalton
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Citations (29)
Analysis of Plasma-Induced Modification of ULK and eULK Materials: Dual Damascene Processing Challenges for 45nm (K ⩽ 2.4) and Beyond BEOL Technologies
2006
IITC | International Interconnect Technology Conference
Nicholas C. M. Fuller
Marcus A. Worsley
Satya V. Nitta
Timothy J. Dalton
T.L. Tai
Stacey F. Bent
Teddie Magbitang
Geraud Dubois
R. D. Miller
W. Volksen
M Sankar
Sampath Purushothaman
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Citations (2)
Effect of Species Density and Ion Scattering During Ashing on Ultra Low-$\kappa $ Inter-Level Dielectric Films
2005
Bulletin of the American Physical Society
Worsley
Stacey F. Bent
Nicholas C. M. Fuller
T.L. Tai
James P. Doyle
M. Rothwell
Timothy J. Dalton
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