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Niclas Heise
Niclas Heise
Materials science
Transfer printing
Wafer
Composite material
Finite element method
3
Papers
1
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0
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(Invited) Micro-Transfer-Printing at X-FAB: Demonstration of a New Technology for Wafer-Level Packaging
2020
Sebastian Wicht
Uwe Krieger
Daniela Guenther
Niclas Heise
Falk Naumann
Alin Fecioru
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Micro-Transfer-Printing and Potential Process Optimizations by FEA
2019
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Kjell Buehler
Georg Lorenz
Marcel Mittag
Uwe Krieger
Niclas Heise
Sebastian Wicht
Ronny Gerbach
Falk Naumann
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MICROPRINCE-Open access pilot line for Micro-Transfer-Printing of functional components on wafer level
2019
Sebastian Wicht
Uwe Krieger
Daniela Guenther
Niclas Heise
Matthias Krojer
Gabriel Kittler
Falk Naumann
Frank Altmann
David Gómez
Alin Fecioru
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