Combined Phase Unwrapping Method Using 2D Information in PMP 3D Measurement

In SMT solder paste deposit 3D measurement based on PMP, conventional phase unwrapping method suffered from shadow, noise and holes. Considering practical engineering condition, phase unwrapping method can be improved using 2D image information: basic principle method was applied to smooth area, quality-guided unwrapping and least-square method were taken in shadow or break area for phase unwrapping respectively. Experimental results show that desired phases can be correctly and quickly unwrapped in proposed method.