Estimation of dynamic stresses in connecting leads of SMC on PCB for launch loads

The electronic assemblies in spacecraft are subjected to quite high vibration loads during the launch phase. The success of the spacecraft mission entirely depends on the safety of these electronics during the ascend phase which ensures their proper functioning in on-orbit conditions. In order to provide high reliable and cost effective electronic packages, system designers should have better understanding of the loads coming on to the printed circuit board and the surface mounted components, mounted on it. © 2020 by the International Astronautical Federation (IAF). All rights reserved.