A Study Of The Interface Between Polyimide And Plated Copper

A polyimide (PI) surface is analyzed by XPS at each electroless-copper-plating step. Zn ions are adsorbed on the PI surface, and subsequently replaced with Pd ions. Cu is deposited on the PI surface catalyzed by these Pd ions, As the surface concentration of Pd ions increases, the adhesive strength of the plated Cu to the PI surface increases. In the case of PI fabrication onto a plated Cu, no significant PI degradation is observed.