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Novel Trench Wiring Formation Process using Photosensitive Insulation Film for Next Generation Packaging
Novel Trench Wiring Formation Process using Photosensitive Insulation Film for Next Generation Packaging
2016
Kenichi Iwashita
Tetsuya Katoh
Akihiro Nakamura
Yasuharu Murakami
Tomio Iwasaki
Keywords:
Organic chemistry
Nanotechnology
Materials science
Trench
Forensic engineering
Photochemistry
Correction
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