Dual-Carrier Process Using Mechanical and Laser Release Technologies for Advanced Wafer-Level Packaging

Temporary bonding and debonding (TBDB) techniques have been adopted for use in large-scale manufacturing and are an integral part of 3-D integration. Today's advance Wafer Level Packaging (WLP) processes are complex and evolving, driven by increasing demand for higher performance packages. A dual-carrier bonding process allows users to temporarily bond a device substrate to a carrier, perform backside processing, flip the substrate and bond a second carrier, then selectively debond from the original carrier. This process maintains structural support for the thinned wafer while it undergoes further downstream processes. The use of adhesive and release materials that have different bonding and debonding properties makes a dual-carrier process attractive for complex 3D stacked IC integration. In this study, multiple bonding and release materials will be evaluated using a dual-carrier bonding process. Various types of substrates will also be used to further characterize this process. Bond quality, ease of release and material cleaning will be evaluated for both mechanical release and laser ablation technologies.