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John P. Massey
John P. Massey
Wafer
Materials science
Optoelectronics
Wafer-level packaging
Embedded Wafer Level Ball Grid Array
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Protecting the Mentally Incompetent Child's Trust Interest from State Reimbursement Claims
2021
John P. Massey
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Temporary and permanent bonding enables 3D integration of ultrathin wafers
2019
Thomas Uhrmann
Elisabeth Brandl
Mariana Pires
Stefan Jung
Julian Bravin
Jürgen Burggraf
Mathias Pichler
Matthew Koch
Luke Prenger
Arthur Southard
John P. Massey
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Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
2019
ECTC | Electronic Components and Technology Conference
Michelle Fowler
John P. Massey
Tanja Braun
S. Voges
Robert Gernhardt
Markus Wöhrmann
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Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
2018
Michelle Fowler
John P. Massey
Matthew Koch
Kevin Edwards
T. Braun
Steve Voges
Robert Gernhardt
Markus Wöhrmann
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Dual-Carrier Process Using Mechanical and Laser Release Technologies for Advanced Wafer-Level Packaging
2018
ECTC | Electronic Components and Technology Conference
Michelle Fowler
John P. Massey
Ramachandran K. Trichur
Matthew Koch
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