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Luke Prenger
Luke Prenger
Materials science
Wafer
Laser
Nanotechnology
Wafer-level packaging
5
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3
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0
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A Single-Layer Solution with Laser Debonding Technology for Temporary Bond/Debonding Applications in Wafer-Level Packaging
2020
CSTIC | China Semiconductor Technology International Conference
Xiao Liu
Lisa M. Kirchner
Luke Prenger
Wenkai Cheng
Rama Puligadda
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Material Design Advancement Create Multifunctional Materials for Single-Layer Bonding and Debonding
2019
Luke Prenger
Xiao Liu
Qi Wu
Rama Puligadda
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Temporary and permanent bonding enables 3D integration of ultrathin wafers
2019
Thomas Uhrmann
Elisabeth Brandl
Mariana Pires
Stefan Jung
Julian Bravin
Jürgen Burggraf
Mathias Pichler
Matthew Koch
Luke Prenger
Arthur Southard
John P. Massey
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The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics
2019
Alain Phommahaxay
Gerald Beyer
Iuliana Radu
Eric Beyne
Alice Guerrero
Luke Prenger
Kim Yess
Kim Arnold
Sebastian Tussing
Walter Spiess
Thomas Rapps
Koen Kennes
Stefan Lutter
Arnita Podpod
Steven Brems
John Slabbekoorn
Erik Sleeckx
Cedric Huyghebaert
Inge Asselberghs
Andy Miller
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Significant Advancement in Laser Ablative Release Layer Material Design Enabling Low-Energy and Low-Residue Debond
2018
Luke Prenger
Qi Wu
Arthur Southard
Debbie Blumenshine
Rama Puligadda
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