Old Web
English
Sign In
Acemap
>
authorDetail
>
Walter Spiess
Walter Spiess
SUSS MicroTec
Materials science
Wafer
Wafer bonding
Anodic bonding
Die preparation
5
Papers
54
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (5)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics
2019
Alain Phommahaxay
Gerald Beyer
Iuliana Radu
Eric Beyne
Alice Guerrero
Luke Prenger
Kim Yess
Kim Arnold
Sebastian Tussing
Walter Spiess
Thomas Rapps
Koen Kennes
Stefan Lutter
Arnita Podpod
Steven Brems
John Slabbekoorn
Erik Sleeckx
Cedric Huyghebaert
Inge Asselberghs
Andy Miller
Show All
Source
Cite
Save
Citations (3)
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material
2016
ECTC | Electronic Components and Technology Conference
Alain Phommahaxay
Goedele Potoms
Greet Verbinnen
Erik Sleeckx
Gerald Beyer
Eric Beyne
Alice Guerrero
Dongshun Bai
Xiao Liu
Kim Yess
Kim Arnold
Walter Spiess
Tim Griesbach
Thomas Rapps
Stefan Lutter
Show All
Source
Cite
Save
Citations (12)
Temporary wafer bonding defect impact assessment on substrate thinning: Process enhancement through systematic defect track down
2012
ECTC | Electronic Components and Technology Conference
Alain Phommahaxay
Greet Verbinnen
Samuel Suhard
Pieter Bex
Joris Pancken
Mark Lismont
Axel Van den Eede
Anne Jourdain
Tobias Woitke
Peter Bisson
Walter Spiess
Bart Swinnen
Gerald Beyer
Andy Miller
Eric Beyne
Show All
Source
Cite
Save
Citations (4)
Process characterization of thin wafer debonding with thermoplastic materials
2012
Electronics System-integration Technology Conference
Alain Phommahaxay
Anne Jourdain
Greet Verbinnen
Tobias Woitke
Ralf Stieber
Peter Bisson
Markus Gabriel
Walter Spiess
Alice Guerrero
Jeremy Mccutcheon
Rama Puligadda
Pieter Bex
Axel Van den Eede
Bart Swinnen
Gerald Beyer
Andy Miller
Eric Beyne
Show All
Source
Cite
Save
Citations (7)
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding
2012
DIC | IEEE International D Systems Integration Conference
Alain Phommahaxay
Anne Jourdain
Greet Verbinnen
Tobias Woitke
Peter Bisson
Markus Gabriel
Walter Spiess
Alice Guerrero
Jeremy Mccutcheon
Rama Puligadda
Pieter Bex
Axel Van den Eede
Bart Swinnen
Gerald Beyer
Andy Miller
Eric Beyne
Show All
Source
Cite
Save
Citations (28)
1