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Kim Arnold
Kim Arnold
Katholieke Universiteit Leuven
Materials science
Wafer
Composite material
Electronic engineering
Silicon
5
Papers
26
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Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up
2018
ECTC | Electronic Components and Technology Conference
Alain Phommahaxay
Arnita Podpod
John Slabbekoorn
Erik Sleeckx
Gerald Beyer
Eric Beyne
Alice Guerrero
Dongshun Bai
Kim Arnold
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Citations (1)
Advances in Thin Wafer Debonding and Ultrathin 28-nm FinFET Substrate Transfer
2017
ECTC | Electronic Components and Technology Conference
Alain Phommahaxay
Anne Jourdain
Goedele Potoms
Greet Verbinnen
Erik Sleeckx
Gerald Beyer
Eric Beyne
Alice Guerrero
Dongshun Bai
Kim Yess
Kim Arnold
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Citations (3)
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material
2016
ECTC | Electronic Components and Technology Conference
Alain Phommahaxay
Goedele Potoms
Greet Verbinnen
Erik Sleeckx
Gerald Beyer
Eric Beyne
Alice Guerrero
Dongshun Bai
Xiao Liu
Kim Yess
Kim Arnold
Walter Spiess
Tim Griesbach
Thomas Rapps
Stefan Lutter
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Citations (12)
Single-release-layer process for temporary bonding applications in the 3D integration area
2015
ECTC | Electronic Components and Technology Conference
Anne Jourdain
Alain Phommahaxay
Dimitrios Velenis
Alice Guerrero
Dongshun Bai
Kim Yess
Kim Arnold
Andy Miller
Kenneth June Rebibis
Gerald Beyer
Eric Beyne
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Citations (7)
Temporary bonding for High-topography Applications: Spin-on Material Versus Dry Film
2014
ECTC | Electronic Components and Technology Conference
Anne Jourdain
Alain Phommahaxay
Greet Verbinnen
Alice Guerrero
Susan Bailey
Mark Privett
Kim Arnold
Andy Miller
Kenneth June Rebibis
Gerald Beyer
Eric Beyne
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Citations (3)
1