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Matthew Koch
Matthew Koch
Free University of Berlin
Wafer-level packaging
System in package
Materials science
Chip
Wafer
2
Papers
12
Citations
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Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes
2018
Michelle Fowler
John P. Massey
Matthew Koch
Kevin Edwards
T. Braun
Steve Voges
Robert Gernhardt
Markus Wöhrmann
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Duromer MID technology for system-in-package generation
2005
IEEE Transactions on Electronics Packaging Manufacturing
Karl-F. Becker
Tanja Braun
Alexander Neumann
Andreas Ostmann
Matthew Koch
Volker Bader
Rolf Aschenbrenner
H. Reichl
Erik Jung
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Citations (12)
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