TOWARDS AN INDUSTRIAL FABRICATION PROCESS FOR ELECTROWETTING CHIP USING STANDARD MEMS TECHNOLOGY

Reliability of Electrowetting on Dielectric (EWOD) microsystems partly relies on the hydrophobic layer. A process for depositing a SIOC (organosiloxane molecule) material fitting all the needs was firstly established on a laboratory equipment, then further transferred on an industrial machine devoted to microelectronics fabrication. For packaging purposes, this layer has to be patterned on the EWOD chip. A lift-off process was investigated and showed promising results. Simplifying the packaging steps is essential for a rapid cycle fabrication to test. In this way, an experimental setup was developed in order to directly make electrical contact on the EWOD chip.