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Chip cracks during assembly: Finding and eliminating the critical defect
Chip cracks during assembly: Finding and eliminating the critical defect
2011
Wolfgang Sauter
Steffen Kaldor
Jennifer Clark
Stephane Laforte
Clare McCarthy
Darryl D. Restaino
Jon A. Casey
David L. Questad
Keywords:
Chip
Electronic engineering
Materials science
Correction
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