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Stephane Laforte
Stephane Laforte
IBM
Chip
Electronic engineering
Materials science
Composite material
Stress (mechanics)
2
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Chip cracks during assembly: Finding and eliminating the critical defect
2011
Electronic Components and Technology Conference
Wolfgang Sauter
Steffen Kaldor
Jennifer Clark
Stephane Laforte
Clare McCarthy
Darryl D. Restaino
Jon A. Casey
David L. Questad
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Chip cracks during assembly: Finding and eliminating the critical defect
2011
ECTC | Electronic Components and Technology Conference
Wolfgang Sauter
Steffen Kaldor
Jennifer Clark
Stephane Laforte
Clare McCarthy
Darryl D. Restaino
Jon A. Casey
David L. Questad
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