Reliability assessment in welding process of SiP with dual-chamber by finite element analysis

In this paper, a state-of-the art SiP with dual-chamber was established. The new structure contained bumps, chips, ceramic substrate, pins and cover plates. The deformation, principal stress and principal strain of all parts in welding process were analyzed by computer simulation and prediction techniques. The largest deformation, which was 95.97 μm, occurred in the ceramic substrate. The maximum value of principal stress was 653.59 MPa. It happened in the bumps of flip chip and exceeded the yield strength of SnAg. The maximum value of principal strain was 0.89% and it also occurred in the bumps of flip chip. The weakness of SiP in welding process was founded and it was very meaningful for future research.