assembly process of electronic components on a support

A method of assembly of at least one electronic component (100) on a support (102), comprising at least the steps of: - processing adapted to make hydrophilic at least one zone (116) of the support for receiving the electronic component, - depositing a volume of water on said area of ​​the support, - dissolution of a glue in the volume of water, forming a volume of aqueous adhesive onto said area of ​​the support, - electronic component placement on the volume of adhesive aqueous, - drying the volume of aqueous adhesive forming a bonding interface (126) solidarisant the electronic component to the substrate.