Photoresist and plating resist composition, application thereof and base material comprising film layer formed by the photoresist and plating resist composition

The invention relates to a photoresist and plating resist composition, an application thereof and a base material comprising a film layer formed by the photoresist and plating resist composition. The photoresist and plating resist composition comprises, by weight, 3-15 parts of a photoinitiator composition, 20-80 parts of alkali and water soluble photocurable resin, 1-20 parts of photocurable composition, 10-40 parts of filler, 1-30 parts of solvent and 1-10 parts of additive, based on 100 weight parts of photoresist and plating resist composition. The photoinitiator composition is the kind of photoinitiator compositions which can generate ultraviolet absorption in a waveband range of 230nm-405nm and can generate free radicals. The photoresist and plating resist composition is rapid in photocuring and has excellent corrosion resistance and plating resistance.