Effect of Wafer Wettability on Marangoni Drying Performance in Post–CMP Cleaning

Marangoni drying is an advanced drying technique to obtain ultraclean surface in IC manufacturing. The previous studies on drying mechanism were based on the hydrophilic wafer, and the effect of wafer wettability on drying performance has not been investigated. In this study, a model for Marangoni drying with a nonzero contact angle was proposed to analyze the evolution of flow field and the particle desorption. Further, the Marangoni drying experiments with different wettability wafer were performed. Results revealed that Marangoni effect induces the receding of contact line and an increase in dynamic contact angle. Additionally, the generated Marangoni-driven flow improves the desorption of contaminants from the wafer surface and thus achieves a better drying performance.