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A study of non-flow under-fill flip-chip bonding process for LCP based cof components
A study of non-flow under-fill flip-chip bonding process for LCP based cof components
2003
Satoshi Furuki
Hiroyuki Takahashi
Chihiro Hatano
Makoto Yamasaki
Keywords:
Electronic engineering
Flip chip
Electrical engineering
Materials science
bonding process
Flow (psychology)
Mechanical engineering
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